Course name Printed Electronics Methods and Applications
Course date 29.08.2022 - 31.05.2023
Institution Oulu University of Applied Sciences
Course language English
Credits 5 ECTS credit

Field Technology HUB
Teacher Harri Määttä, Tomi Tuomaala
Available for open UAS Chargeable
Level Master’s level

Queries related to enrolment practices
Enrolment period 15.08.2022 - 10.04.2023
Implementation plan
OPEN UAS Enrolment

Printed Electronics Methods and Applications

29.08.2022 - 31.05.2023

Course description


After studying the course, the student learns the basics of various types of printing processes, their possibilities and their constraints. The student will be able to evaluate the suitability of printing techniques for manufacturing and understand printing technology’s integration into various types of processes, and is able to self-study more deeply the theory and processes of that area. The student understands the potential of production processes and is able to perceive the use of technology in the light of applications. The student receives knowledge about the design of printed intelligence structures. The student knows the physical tools needed in design and implementation of printed intelligence and also in other purposes. The student will be able to visualize the future applications of printed intelligence.

The student has the necessary knowledge and skills for laboratory work: occupational safety, materials, electrical measurements, microscopy, electrochemical measurements, environmental conditions, surface profile and quality analysis. The trainee is able to combine the basics of his learning into practice.


Printing processes and methods. Characterization methods. Printed electronics applications.

Assessment criteria

Scale 0-5.

Course way of working and time table

Online continuous implementation.

Brief on-line introductions to technology, individual self-learning based on given material, several small individual and/or group learning activities and exercises in Moodle learning management system.